CPU相关词汇 发布日期:2005-6-24 10:50:20 来源:译盟翻译 3DNow! (3D no waiting) ALU (Arithmetic Logic Unit,算术逻辑单元) AGU(Address Generation Units,地址产成单元) BGA (Ball Grid Array,球状矩阵排列) BHT (branch prediction table,分支预测表) BPU(Branch Processing Unit,分支处理单元) Brach Pediction (分支预测) CMOS:Complementary Metal Oxide Semiconductor,互补金属氧化物半导体 CISC(Complex Instruction Set Computing,复杂指令集计算机) CLK(Clock Cycle,时钟周期) COB(Cache on board,板上集成缓存) COD(Cache on Die,芯片内集成缓存) CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列) CPU(Center Processing Unit,中央处理器) Data Forwarding(数据前送) Decode(指令解码) DIB(Dual Independent Bus,双***总线) EC(Embedded Controller,嵌入式控制器) Embedded Chips(嵌入式) EPIC(explicitly parallel instruction code,并行指令代码) FADD(Floationg Point Addition,浮点加) FCPGA(Flip Chip Pin Grid Array,反转芯片针脚栅格阵列) FDIV(Floationg Point Divide,浮点除) FEMMS:Fast Entry/Exit Multimedia State,快速进入/退出多媒体状态 FFT(fast Fourier transform,快速热欧姆转换) FID(FID:Frequency identify,频率鉴别号码) FIFO(First Input First Output,先入先出队列) flip-chip(芯片反转) FLOP(Floating Point Operations Per Second,浮点操作/秒) FMUL(Floationg Point Multiplication,浮点乘) FPU(Float Point Unit,浮点运算单元) FSUB(Floationg Point Subtraction,浮点减) GVPP(Generic Visual Perception Processor,常规视觉处理器) HL-PBGA: 表面黏著,高耐热、轻薄型塑胶球状矩阵封装 IA(Intel Architecture,英特尔架构) ICU(Instruction Control Unit,指令控制单元) ID:identify,鉴别号码 IDF(Intel Developer Forum,英特尔开发者论坛) IEU(Integer Execution Units,整数执行单元) IMM: Intel Mobile Module, 英特尔移动模块 Instructions Cache,指令缓存 Instruction Coloring(指令分类) IPC(Instructions Per Clock Cycle,指令/时钟周期) ISA(instruction set architecture,指令集架构) KNI(Katmai New Instructions,Katmai新指令集,即SSE) Latency(潜伏期) LDT(Lightning Data Transport,闪电数据传输总线) Local Interconnect(局域互连) MESI(Modified, Exclusive, Shared, Invalid:修改、排除、共享、废弃) MMX(MultiMedia Extensions,多媒体扩展指令集) MMU(Multimedia Unit,多媒体单元) MFLOPS(Million Floationg Point/Second,每秒百万个浮点操作) MHz(Million Hertz,兆赫兹) MP(Multi-Processing,多重处理器架构) MPS(MultiProcessor Specification,多重处理器规范) MSRs(Model-Specific Registers,特别模块寄存器) NAOC(no-account OverClock,无效超频) NI:Non-Intel,非英特尔 OLGA(Organic Land Grid Array,基板栅格阵列) OoO(Out of Order,乱序执行) PGA: Pin-Grid Array(引脚网格阵列),耗电大 PR(Performance Rate,性能比率) PSN(Processor Serial numbers,处理器序列号) PIB(Processor In a Box,盒装处理器) PPGA(Plastic Pin Grid Array,塑胶针状矩阵封装) PQFP(Plastic Quad Flat Package,塑料方块平面封装) RAW(Read after Write,写后读) Register Contention(抢占寄存器) Register Pressure(寄存器不足) Register Renaming(寄存器重命名) Remark(芯片频率重标识) Resource contention(资源冲突) Retirement(指令引退) RISC(Reduced Instruction Set Computing,精简指令集计算机) SEC: Single Edge Connector,单边连接器 Shallow-trench isolation(浅槽隔离) SIMD(Single Instruction Multiple Data,单指令多数据流) SiO2F(Fluorided Silicon Oxide,二氧氟化硅) SMI(System Management Interrupt,系统管理中断) SMM(System Management Mode,系统管理模式) SMP(Symmetric Multi-Processing,对称式多重处理架构) SOI: Silicon-on-insulator,绝缘体硅片 SONC(System on a chip,系统集成芯片) SPEC(System Performance Evaluation Corporation,系统性能评估测试) SQRT(Square Root Calculations,平方根计算) SSE(Streaming SIMD Extensions,单一指令多数据流扩展) Superscalar(超标量体系结构) ***: Tape Carrier Package(薄膜封装),发热小 Throughput(吞吐量) TLB(Translate Look side Buffers,翻译旁视缓冲器) USWC(Uncacheabled Speculative Write Combination,无缓冲随机联合写操作) VALU(Vector Arithmetic Logic Unit,向量算术逻辑单元) VLIW(Very Long Instruction Word,超长指令字) VPU(Vector Permutate Unit,向量排列单元) VPU(vector processing units,向量处理单元,即处理MMX、SSE等SIMD指令的地方)
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